发明名称 Micro-injecting device
摘要 <p>The present invention relates to a micro-injecting device in which a cohesion promoting layer is formed between a protective layer and a heating chamber barrier layer. The cohesion promoting layer is formed using y-aminopropyltriethoxysilane. The cohesion promoting layer is capable of enhancing the cohesion of the protective layer and the heating chamber barrier layer and thereby enhancing the general injecting performance of the micro-injecting device. &lt;IMAGE&gt;</p>
申请公布号 EP0999052(A2) 申请公布日期 2000.05.10
申请号 EP19990308742 申请日期 1999.11.03
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 AHN, BYUNG-SUN;ZUKOV, ANDREY ALEKSANDROVICH;DUNAEV, BORIS NIKOLAEVICH
分类号 B41J2/045;B41J2/055;B41J2/14;B41J2/16;(IPC1-7):B41J2/14 主分类号 B41J2/045
代理机构 代理人
主权项
地址