发明名称 BOARD FOR BUILDING
摘要 PROBLEM TO BE SOLVED: To obtain moistureproofness and airtightness in a highly airtight-highly heat insulating construction method in a laminated body wherein an aluminum layer and a synthetic resin film are formed on at least one side of a wooden base board through an adhesive wherein a rot-proof and anti-termite agent is mixed by providing the synthetic resin film on the side of the wooden base board. SOLUTION: A laminated body S comprising an aluminum layer 3 and a synthetic resin film 2 is bonded to one of the sides of a wooden base board 1 with an adhesive 7 wherein a rot-proof and anti-termite agent is mixed so that the film 2 comes into contact with the board 1. As a result, heat insulating properties can be improved by the improved heat radiation capacities of the outermost layer 3. As the board 1, a plywood, wood chip board, wood fiber board, veneer, or laminated board are used. And the thickness of the film 2 is 10-40μm, while the layer 3 is formed by bonding an aluminum foil having a thickness of 5-40μm or by depositing an aluminum in the thickness of 400-800Å.
申请公布号 JP2000127296(A) 申请公布日期 2000.05.09
申请号 JP19980318306 申请日期 1998.10.22
申请人 NODA CORP 发明人 OMURA MASATOSHI
分类号 E04B1/72;B32B15/10;B32B15/20;B32B21/08;(IPC1-7):B32B15/10 主分类号 E04B1/72
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