| 摘要 |
PROBLEM TO BE SOLVED: To improve and simplify the stage of imparting conductivity to the surface of a nonconductive porous material before electroplating and to provide a metal plating method which necessitates no expensive noble metals or leave no or only a limited amt. of various metals and chemical substances on the inner and outer surfaces of the material. SOLUTION: A reducing agent prepared by mixing a reducing material and a binder is applied on the surface of the nonconductive porous material to form a reducing agent layer on the material surface, an aq. soln. of a metal salt to be reduced is sprayed on the porous material surface. Then a conductive layer is formed by depositing a metal by the reduction of the metal salt, and the surface of the conductive layer is electroplated to form a metal plating layer.
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