| 摘要 |
PROBLEM TO BE SOLVED: To provide electronic part-joining adhesives which can be stored for a period of time without damaging the curing rate. SOLUTION: In the one-pack type electronic part-joining adhesive containing a curing agent 2 and a chief agent 1 which is heat-cured by the reaction with this curing agent, the curing agent 2 is incorporated into the adhesive as the solid particles of an imidazole. Preferably, a curing accelerator for accelerating curing of the chief agent of, e.g. an epoxy resin is further mixed into the adhesive as the solid particles, and conductive particles may further be incorporated thereinto.
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