| 摘要 |
PROBLEM TO BE SOLVED: To obtain a polybenzoxazole precursor for the corresponding heat- resistant resin with excellent thermal properties, electrical properties, physical properties and mechanical properties and useful in semiconductor applications by including repeating units of a specific structure. SOLUTION: This polybezoxazole precursor is composed of a repeating unit of formula I (n) is 2-1,000; X is a group of formula II [Y is a group of formula III, SO2, O, or the like] or the like; RX1 and RX2 are each H or CmF2m+1 ((m) is 1-10), at least one of RX1 and RX2 being CmF2m+1}, obtained, for example, by acid chloride method or condensation reaction between a bisaminophenol compound with one of the above structures of Y and bistrifluoromethyl hydroxycarbonylphenyl hexafluoropropane or the like in the presence of a dehydrocondensation agent such as a polyphosphoric acid or dicyclohexyldicarbodiimide. By treating this precursor under heating or with a dehydrating agent to effect condensation reaction, the corresponding polybenzoxazole resin of formula IV can be obtained.
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