ELECTROLESS PLATING HOLDER AND ELECTROLESS PLATING METHOD

摘要

PROBLEM TO BE SOLVED: To provide an electroless plating holder and electroless plating method by which the contacts and collisions of ceramic element assemblies with one another are prevented so that the ceramic assemblies are never cracked or broken. SOLUTION: Electroless plating is conducted by using an electroless plating holder 1 provided with plural cells 10 for separately housing plural ceramic element assemblies 2. The holder 1 is rotated or oscillated in a plating tank around a shaft 16 to promote the movement of the assemblies 2 in the cells 10 so that a more uniform plating film is deposited.