发明名称 |
Device and a method for applying a plurality of solder globules to a substrate |
摘要 |
A method for applying a plurality of solder globules to a substrate has a solder-globule fixing method, a plurality of glass fibers and a fibre holder. The solder-globule fixing method has provided therein a plurality of passages whose cross-sectional areas are smaller than the cross-sectional areas ofthe solder globules to be applied. The fibre holder is arranged relative to the solder-globule fixing device in such a way that between the fibre holder and the solder-globule fixing device a cavity is formed, which is adapted to be acted upon when submitted to pressure via a pressure-transmitting conduit. The fibre holder holds the glass fibres in alignment with the passages.
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申请公布号 |
US6059176(A) |
申请公布日期 |
2000.05.09 |
申请号 |
US19980056479 |
申请日期 |
1998.04.07 |
申请人 |
PAC TECH PACKAGING TECHNOLOGIES G.M.B.H. |
发明人 |
AZDASHT, GHASSEM;AZADEH, RAMIN;RUETHNICK, CLEMENS;LANGE, MARTIN |
分类号 |
B23K3/06;B23K35/14;G02B6/42;H05K3/34;(IPC1-7):B23K35/12;B23K31/02;B23K1/20;B23K26/00 |
主分类号 |
B23K3/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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