发明名称 METAL FOIL CLAD LAMINATE
摘要 <p>PROBLEM TO BE SOLVED: To permit the execution of withstand voltage test surely without using any cutting machine or the like even when the size of a metal foil clad laminate is thin or large. SOLUTION: A laminate 8 is formed by superposing metal foils (copper foils 7, 7) on both sides of at least one sheet or more of prepreg 6 and, thereafter, heating and pressurizing. In this case, the size of the metal foils (copper foils 7, 7) is determined so as to be larger than that of the prepreg 6 in both of longitudinal size and lateral size while cut-off members (polyimide tapes 9) are buried near four sides of the prepreg 6.</p>
申请公布号 JP2000127295(A) 申请公布日期 2000.05.09
申请号 JP19980306949 申请日期 1998.10.28
申请人 HITACHI CHEM CO LTD 发明人 IIJIMA TOSHIYUKI
分类号 H05K1/03;B32B15/08;B32B37/10;H05K3/00;(IPC1-7):B32B15/08;B32B31/20 主分类号 H05K1/03
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