| 摘要 |
PCT No. PCT/EP96/03662 Sec. 371 Date Jan. 28, 1998 Sec. 102(e) Date Jan. 28, 1998 PCT Filed Aug. 21, 1996 PCT Pub. No. WO97/08589 PCT Pub. Date Mar. 6, 1997There are described a method and a device for uniform chemical detachment of layers of resist in the form of easily-filtered particles from plate-shaped surfaces of a material for electroplating. The method is preferably used in horizontal continuous systems in printed circuit board technology. According to prior art, spraying and squirting processes are used for resist stripping. Disadvantageous among other things is the short service life of the bath due to the resist which cannot be entirely filtered out of the solution due to dissolution. According to the invention, the resist is detached from the surfaces of the printed circuit boards with only moderately flowing treatment liquids. In the first process stage a large quantity of treatment liquid is applied in a wave for swelling to the surfaces of the printed circuit boards by means of longitudinally-extended wave nozzles. in the second stage, for film detachment, wave nozzles having pressure in suction areas are preferably used. The post-treatment is carried out by flooding with reinforcement by intensive flows. The method operates without waste water with a multi-stage cascade rinsing, and with a long service life of the detachment agent. The resist detached from the surface is rapidly passed to a solid material filter by a short path and separated from the solvent before dissolving. The film is filtered out almost entirely and in an almost dry condition.
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