| 摘要 |
PROBLEM TO BE SOLVED: To produce an aluminum nitride-based sintered compact without causing cracks in a heat radiating wiring board and without breaking wiring conductors even when used in the heat radiating wiring board used by making a large current such as >=100 A flow therethrough and in a cold heat environment at -40 to +150 deg.C. SOLUTION: This aluminum nitride-based sintered compact contains aluminum nitride and at least one or more kinds selected from oxides of group 3a elements of the periodic table and 0.1-30 wt.% of at least one or more kinds selected from nitrides, carbides, silicides and borides of groups 4a, 5a and 6a elements and having 1.0-30 μm average grain diameter and has >=1×1010 Ω.cm volume resistivity. The aluminum nitride-based sintered compact is used as a material for a heat radiating wiring board. |
