发明名称 INLINE TYPE SPUTTERING DEVICE AND SPUTTERING METHOD
摘要 PROBLEM TO BE SOLVED: To form a thin film having a uniform film thickness distribution on a large substrate without using a large target by arranging plural target segments over a length equivalent to the whole width of a substrate. SOLUTION: In a film forming chamber 40, orthogonally to the carrying direction of a substrate 10, plural, e.g. target segments 101 to 105 devided into 5 pieces are arranged at prescribed intervals oppositely to the substrate 10. When the target segments 101 to 105 are arranged, so as to be made equivalent at least to the whole length of the substrate 10, the area, the total number and intervals at the time of the arrangement are controlled. Among the target segments 101 to 105, the target segments 101 and 105 positioning at both ends in the outermost directions are made closest to the substrate 10. Even in the case discharge electric power is equally applied to the cathodes of all the target segments 101 to 105, in the target segments 101 and 105 positioning at both endes in the outermost directions, the film forming speed is made high, and the film thicknesses of both ende parts in the substrate 10 are made higher than that of the other part.
申请公布号 JP2000129436(A) 申请公布日期 2000.05.09
申请号 JP19990228594 申请日期 1999.08.12
申请人 ASAHI GLASS CO LTD 发明人 KAGEYAMA JUNICHI;SHIDOUJI EIJI;AKAO YASUHIKO
分类号 C23C14/34;(IPC1-7):C23C14/34 主分类号 C23C14/34
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