发明名称 LIQUID SUPPLY DEVICE FOR DEPOSITION APPARATUS
摘要 PROBLEM TO BE SOLVED: To make it possible to supply the liquid to be supplied to a treatment chamber of a liquid supply device of a deposition apparatus without allowing the liquid to come into contact with this liquid. SOLUTION: The liquid supply device 10 has a volume variable type vessel 16. This volume variable type vessel 16 has a vessel body 18 and a freely elastically deformable diaphragm 20 disposed in this vessel body 18 and is separated to a liquid storage chamber 22 and a gas supply chamber 24 by this diaphragm 20. The liquid storage chamber 22 and a treatment chamber 14 are connected by liquid supply piping 26. This liquid supply piping 26 is provided with a pump 30. When this pump 30 is driven, the organic metal stored in the liquid storage chamber 22 is sucked. Namely, a reduced pressure state is generated in the liquid storage chamber 22 and, therefore, the diaphragm 20 deflects toward the liquid storage chamber 22 side and the volume of the liquid storage chamber 22 is reduced. The organic metal is then delivered to the treatment chamber 14.
申请公布号 JP2000129446(A) 申请公布日期 2000.05.09
申请号 JP19980308672 申请日期 1998.10.29
申请人 APPLIED MATERIALS INC 发明人 WADA YUICHI;SHODA HIROYUKI;AIDA HISASHI;YOSHIDA NAOMI
分类号 H01L21/285;C23C16/44;C23C16/448;C23C18/02;C23C18/08;H01L21/288;H01L21/3205;(IPC1-7):C23C16/448 主分类号 H01L21/285
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