发明名称 Surface mounting part
摘要 The present invention is to provide a surface mounting part, capable of corresponding to high density mounting of a mother board (10) and capable of achieving a small size, to be mounted on a mother board (10) by reflow. Electronic parts (2,3) are mounted on both sides of a printed board (1). Terminal electrodes (3a) of the electronic parts (3) mounted on the rear side are provided as terminals for connecting with the mother board (10). <IMAGE>
申请公布号 EP0996323(A3) 申请公布日期 2000.05.03
申请号 EP19990119684 申请日期 1999.10.05
申请人 TDK CORPORATION 发明人 KUDOH, KAZUO;KATSUMATA, MASASHI
分类号 H05K1/18;H03B5/32;H03H9/02;H05K1/14;H05K3/30;H05K3/34;H05K3/36 主分类号 H05K1/18
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