发明名称 Complex for the high dielectric film deposition and the method of deposition
摘要 Organometallic compounds of the formula M(C11H19O2)x(OCH(CH3)2)y : Ln (I) M is a metal selected from Group IIA, Group IIIA, Group IVA, Group IIIB, Group IVB, Group VB or Group VIIIA; L is organic amine; n is an integer greater than 1; and x and y are integers from 0 to 4, provided that x + y is an integer from 2 to 4 and preparation thereof. Also disclosed are vapour deposition precursor compositions comprising (I) and a process for forming a high dielectric thin film comprising the steps of vapor depositing a high dielectric thin film on a substrate heated at 350 to 700 DEG C using argon, helium, hydrogen, oxygen or mixtures thereof as the carrier and reaction gas, wherein the thin film precursor is an organometallic compound of Formula I.
申请公布号 EP0994118(A3) 申请公布日期 2000.05.03
申请号 EP19990307253 申请日期 1999.09.14
申请人 ROHM AND HAAS COMPANY 发明人 SHIN, HYUN-KOOCK
分类号 H01L21/312;C07F3/00;C07F3/04;C07F5/00;C07F7/00;C07F7/24;C07F7/28;C07F9/00;C07F15/00;C23C16/18;C23C16/40;H01L21/8242;H01L27/108 主分类号 H01L21/312
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