| 摘要 |
The casing has provision for multiple filter elements within common outer casing. The module for electronic components includes an encapsulation box, inside which components may be superimposed. At least two such components are surface wave devices formed on the surface of a substrate. The components are mounted on flexible supports, and the box may include internal steps, such that an upper component (222) may be supported above a lower component (221) on supports (421,321) without the components themselves being in contact. The internal structure of the box may be a series of steps to support the components, all of which lie parallel to the base of the box. |
