发明名称 Heat pipe with improved wick structures
摘要 An improved planar heat pipe wick structure having projections formed by micromachining processes. The projections form arrays of interlocking, semi-closed structures with multiple flow paths on the substrate. The projections also include overhanging caps at their tops to increase the capillary pumping action of the wick structure. The capped projections can be formed in stacked layers. Another layer of smaller, more closely spaced projections without caps can also be formed on the substrate in between the capped projections. Inexpensive materials such as Kovar can be used as substrates, and the projections can be formed by electrodepositing nickel through photoresist masks.
申请公布号 US6056044(A) 申请公布日期 2000.05.02
申请号 US19970987960 申请日期 1997.12.10
申请人 SANDIA CORPORATION 发明人 BENSON, DAVID A.;ROBINO, CHARLES V.;PALMER, DAVID W.;KRAVITZ, STANLEY H.
分类号 F28D15/02;F28D15/04;(IPC1-7):F28D15/00 主分类号 F28D15/02
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