| 摘要 |
A power pack including a power device and driver circuit sandwiched between a base plate and a lid. The base plate and lid having flat exterior surfaces for bonding with heat exchangers and/or an external bus to provide both two-sided cooling and two-sided electrical access. The driver circuit and power device are spaced apart to allow parallel and separate thermal conduction paths to both the base plate and lid. The power pack further including a seal enclosing the power device and driver circuit between the base plate and lid.
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