发明名称 |
Slurry supply system for chemical mechanical polishing |
摘要 |
A chemical mechanical polishing apparatus for semiconductor wafers that ensures uniform planarization of said wafers is described. Said chemical mechanical polishing apparatus comprises a slurry supply system that channels slurry through the platen and pad, and a carrier head with provision to hold the wafer. The pad contains grooves for uniform distribution of the slurry under the rotating wafer thus eliminating uneven planarization as in prior art.
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申请公布号 |
US6056851(A) |
申请公布日期 |
2000.05.02 |
申请号 |
US19980134549 |
申请日期 |
1998.08.14 |
申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY |
发明人 |
HSIEH, SHIH-HUANG;CHEN, LI-DUM |
分类号 |
B24B37/04;B24B57/02;B24D13/14;(IPC1-7):B24B21/04 |
主分类号 |
B24B37/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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