发明名称 Contactless nonvolatile semiconductor memory device having buried bit lines surrounded by grooved insulators
摘要 In a contactless nonvolatile semiconductor memory device including a semiconductor substrate and a plurality of impurity diffusion layers of a rectangular shape serving as sub bit lines on the semiconductor substrate, a plurality of grooves of a rectangular shape are formed in the semiconductor substrate between the impurity diffusion layers. Also, a first gate insulating layer is formed on the semiconductor substrate within the grooves, and a plurality of floating gate electrodes are formed on the gate insulating layer. Further, a second gate insulating layer is formed on the floating gate electrodes, and a plurality of word lines are formed on the second gate insulating layer.
申请公布号 US6057574(A) 申请公布日期 2000.05.02
申请号 US19970939947 申请日期 1997.09.29
申请人 NEC CORPORATION 发明人 HISAMUNE, YOSIAKI
分类号 H01L21/8247;H01L27/115;H01L29/788;H01L29/792;(IPC1-7):H01L29/788 主分类号 H01L21/8247
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