| 摘要 |
An apparatus and method for loading integrated circuit packages into package carriers is disclosed. Featured is a pick-and-place mechanism (e.g., 107) mounted on a tiltable table (e.g., 101). Packages (e.g., 13) and carriers (e.g., 11) slide toward the pick-and-place mechanism (e.g., 107) under the influence of gravity. The pick-and-place mechanism (e.g., 107) combines the packages (e.g., 13) with carriers (e.g., 11). The package/carrier combinations then slide away from the pick-and-place mechanism (e.g., 107). |
