| 摘要 |
A test socket structure in which a contact pin of a defective socket is replaced by block unit, and a pattern of a printed circuit board of a testing equipment is not abraded during testing of a semiconductor device. A fabricating method of a contact pin is disclosed by which the contact pin is hardly deformed and its spring elastic force can be maintained for a long time. Test socket including: a first housing (51) made of an insulating material having a predetermined thickness; a second housing (52) made of an insulating material, a side wall of which is adjacent to a side wall of the first housing; a first (53) and a second elastomers (54) respectively installed at an upper and a lower surfaces of the second housing; and a contact pin block (55) having a plurality of contact pins arranged at predetermined pitches and a fixing unit (55b) for fixing the plurality of contact pins so that they can be moved together, wherein the contact pin block is insertedly installed between the first and the second housings and is contacted with the first and the second elastomers in the vicinity of both end portions of the contact pin. |
