| 摘要 |
An apparatus for placing solder balls in a pattern on a substrate, e.g., to form a ball grid array, the apparatus comprising a template having a first plane, a second plane, and a plurality of holes passing substantially orthogonally through the first and second planes parallel to an axis and corresponding in location to the pattern. Each of the holes is slightly larger than a solder ball diameter. The apparatus also including a porous base having first and second planes, wherein the first plane of the base contacts the second plane of the template. The base is permeable to a fluid in a first direction from the first plane of the template toward the second plane of the base. The apparatus further includes a fluid controller in fluid communication with the base for selectively causing the fluid to pass through the holes and through the base in the first direction to force the solder balls into the holes. The base optionally but preferably comprises a carbon material, such as a carbon graphite material, and the fluid preferably comprises air. |
