发明名称 |
MOUNTING DEVICE OF COMPONENT |
摘要 |
PURPOSE: A mounting device is provided to improve the efficiency of mounting electronic components by enabling the mounting of a number of components on a printed circuit board in a short time. CONSTITUTION: Components held by a component stage are mounted by a mounting head on a board that is held by a board holding stage. The mounting head is provided with a holding member that is provided with a vacuum holding bit that vacuum holds the components and a positioning chuck that positions the components to predetermined positions. A camera unit(31) is arranged detachably to the component stage and the image of component is taken in by the camera(45) of the camera unit(31). A light shielding cover(51) is arranged detachably to the camera unit(31) and the light shielding cover(51) is held by the positioning chuck and mounted on the mounting head detachably. |
申请公布号 |
KR100254262(B1) |
申请公布日期 |
2000.05.01 |
申请号 |
KR19970002396 |
申请日期 |
1997.01.28 |
申请人 |
SAMSUNG TECHWIN CO.,LTD. |
发明人 |
OKAZAKI, TADAO;AONO, HIDEAKI |
分类号 |
H01L21/02;H05K13/04;(IPC1-7):H01L21/02 |
主分类号 |
H01L21/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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