发明名称 MOUNTING DEVICE OF COMPONENT
摘要 PURPOSE: A mounting device is provided to improve the efficiency of mounting electronic components by enabling the mounting of a number of components on a printed circuit board in a short time. CONSTITUTION: Components held by a component stage are mounted by a mounting head on a board that is held by a board holding stage. The mounting head is provided with a holding member that is provided with a vacuum holding bit that vacuum holds the components and a positioning chuck that positions the components to predetermined positions. A camera unit(31) is arranged detachably to the component stage and the image of component is taken in by the camera(45) of the camera unit(31). A light shielding cover(51) is arranged detachably to the camera unit(31) and the light shielding cover(51) is held by the positioning chuck and mounted on the mounting head detachably.
申请公布号 KR100254262(B1) 申请公布日期 2000.05.01
申请号 KR19970002396 申请日期 1997.01.28
申请人 SAMSUNG TECHWIN CO.,LTD. 发明人 OKAZAKI, TADAO;AONO, HIDEAKI
分类号 H01L21/02;H05K13/04;(IPC1-7):H01L21/02 主分类号 H01L21/02
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