HEATING CHAMBER FOR FABRICATION OF SEMICONDUCTOR DEVICE

摘要

PURPOSE: A circular heating plate is provided to uniformly heat a wafer and to be capable of forming an uniform film quality on a wafer by uniformly heating the wafer. CONSTITUTION: A dual wafer system has an angular heating plate attached within a heating chamber for heating a wafer(4). The wafer system includes a circular heating plate(5) having the same shape to the wafer(4) in place of a conventional rectangular heating plate. The circular heating plate(5) uniformly heats the entire surface of the wafer(4). It is preferred that the diameter of the circular heating plate(5) be 1.1 - 1.6 times of that of the wafer(4) to be heated.