| 摘要 |
PURPOSE: A magnet device of semiconductor magnetron sputtering equipment is provided to extent target lifetime, and to form a layer with uniform thickness on a wafer. CONSTITUTION: A magnet fixing plate is attached on a magnetron fixing plate(31). On the magnet fixing plate, a supporting magnet(34) is installed central symmetrically to a primary magnet(33). Between two magnets(33, 34), a shield(35) is set up to shelter interference in magnetic field. The magnetron fixing plate(31) is rotated by a motor.
|
