| 发明名称 |
INJECTION MOLDING PROCESS, MOLD FOR INJECTION MOLDING, AND INJECTION MOLDED ARTICLE |
| 摘要 |
<p>The invention is a flexible packaging material having a narrow side band (10) of pressure sensitive adhesive (14) beneath a heatsealable surface layer (12). When the material is formed into a package, a heatseal (30) is formed along the side band of pressure sensitive adhesive. When the heatseal is opened, the pressure sensitive adhesive becomes exposed at the surface of the seal, which enables the package to be resealed by manual pressure alone. A particular advantage of the invention is that the pressure sensitive adhesive is present only where it is needed to form the resealable seal. The packaging material is made by side-by-side coextrusion. <IMAGE></p> |
| 申请公布号 |
KR100249034(B1) |
申请公布日期 |
2000.05.01 |
| 申请号 |
KR19920009161 |
申请日期 |
1992.05.28 |
| 申请人 |
PRINTPACT ILLINOIS, INC. |
发明人 |
APOSTOL, YANIDIS;BRUCE, SANDERFORD |
| 分类号 |
B65D33/20;B31B1/62;B32B27/08;B65D33/22;B65D65/40;B65D75/58;(IPC1-7):B65D33/20 |
主分类号 |
B65D33/20 |
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