发明名称 CONNECTOR OF PLATING APPARATUS OF MANUFACTURING SEMICONDUCTOR
摘要 PURPOSE: A connector in a plating apparatus is provided to make uniform plating over the entire lead frame using water or electrolyte solution in a plating process and reduce damage of the surface of the lead frame. CONSTITUTION: A connector in a plating apparatus consists of two rollers(112,113). The first roller(112) has within it an ejection passage(112a) for passing water or electrolyte. The second roller(113) installed adjacent to the first roller(112) has also within it an ejection passage(113a) for passing water or electrolyte. The ejection passages(112a,113a) are formed to direct water or electrolyte toward a lead frame(111) intervened between the two rollers(112,113).
申请公布号 KR100254276(B1) 申请公布日期 2000.05.01
申请号 KR19970076344 申请日期 1997.12.29
申请人 SAMSUNG TECHWIN CO.,LTD. 发明人 LEE, SANG KYUN
分类号 H01L23/48;(IPC1-7):H01L23/48 主分类号 H01L23/48
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