SOLDERING METHOD AND APPARATUS FOR TCP INTEGRATED CIRCUITS

摘要

PURPOSE: An apparatus and method for soldering an integrated circuit is provided to reduce work time and improve soldered quality by installing two holding blocks to absorb an integrated circuit and using the holding blocks by turn. CONSTITUTION: An integrated circuit(100) is cut and formed to form a lead. An integrated circuit board(110) is placed on a pad which corresponds to the integrated circuit(110). The integrated circuit board(110) is transferred to a position where a soldering is processed, through a conveyer(109). A holding block pickup part absorbs a holding block and places it on the integrated circuit. A light beam is emitted on the lead portion of the integrated circuit for a predetermined period of time. The integrated circuit and the holding blocks which are heated as a result of the light beam emission of a high temperature are cooled down. The holding block pickup part absorbs other holding block, places it on other integrated circuit within the printed circuit board. The light beam emission process and cooling process are reiterated.