| 发明名称 |
Image sensor mounted by mass reflow |
| 摘要 |
An integrated circuit (IC) package includes a mold compound, a die, and a window. The mold compound has a frame embedded within it. The frame has a coefficient of thermal expansion that is less than the mold compound. The IC package is capable of being attached to a circuit board via a mass reflow process. |
| 申请公布号 |
AU1444900(A) |
申请公布日期 |
2000.05.01 |
| 申请号 |
AU20000014449 |
申请日期 |
1999.10.11 |
| 申请人 |
INTEL CORPORATION |
发明人 |
KABUL S. SENGUPTA;AZAR ASSADI;ALAN B. ALLEY;ROBERT C. SUNDAHL |
| 分类号 |
G02B5/20;H01L27/14;H01L27/146;H01L31/0203;H05K3/34 |
主分类号 |
G02B5/20 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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