BGA PACKAGE AND METHOD FOR FABRICATION THEREOF

摘要

PURPOSE: A ball grid array(BGA) package and a method for manufacturing the same are provided to be capable of effectively emitting heat generated in the BGA package toward the outside. CONSTITUTION: A ball grid array package includes a lead frame(100) having a bonding finger(102), a chip pad(104) and a tape(106) formed at the rear side of the bonding finger(102) and formed of a metal material. An upper structure of the lead frame(100) includes a conductive epoxy(108) for adhering a chip(110) to the upper side of the chip pad(104). A gold wire(114) connects the bonding finger(102) of the lead frame. The upper structure is encapsulated by means of a mold compound(116) being a thermosetting resin. A lower structure of the lead frame(100) includes a plurality of solder balls(120) connected to the bonding finger(102) of the lead frame(100) and a conductive ink pattern(118) exposed toward the outside of the mold compound(116) and a heat emitting unit(122) connected to the chip pad(104) of the lead frame and the conductive ink pattern(118) and exposed toward the outside of the mold compound(116).