| 摘要 |
PROBLEM TO BE SOLVED: To make peeling of an insulating layer easy while connection strength is stabilized by providing a metal plate with a conductive circuit through an insulating layer, removing a part of the insulating layer so that the metal plate is exposed, and forming the exposed part to flat. SOLUTION: Related to a metal base circuit board, an insulating layer 2 of a resin comprising an inorganic filler is provided on a metal plate 1, a metal foil is pasted, and after an insulating layer 2 is heated for setting, the metal foil is etched to provide a plurality of conductor circuits 3, thus providing a metal base circuit board mother-plate. Then it is divided into individual metal base circuit boards with a press die. A part of the insulating layer 2 on the metal plate 1 of the metal base circuit board is peeled by a laser so that a part of the metal plate 1 is exposed, with the exposed part formed to flat. Thus, peeling of the insulating layer 2 is easily done with a connection strength stable. |
