| 摘要 |
PROBLEM TO BE SOLVED: To provide an apparatus and a method for manufacturing semiconductors by which the occurrence in which the resulting products of reaction adhering to the device fall down and damages to wafers is prevented. SOLUTION: A semiconductor device manufacturing apparatus is provided with reactive gas ports 11 and 12 provided at the central part of a dispersion head H to which a wafer 17 faces opposite and from which a reaction gas is blown out towards the wafer 17, shield gas ports 14 which are provided around the ports 11 and 12 and from which a shield gas is blown out, and exhaust ports 13 which are provided around the ports 14 and from which un- reacted gases and resulting products of reaction are discharged. The shield gas ports 14 are inclined toward the exhaust ports 13.
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