| 摘要 |
PROBLEM TO BE SOLVED: To provide a soldering evaluation test board that is capable of evaluating soldering characteristics related to a space between through-holes, the diameter of a through-hole, and the diameter of a land. SOLUTION: A test pattern forming region 2a where through-holes 16 are arranged gradually varying in a space between the adjacent through-holes and lands 15 are arranged gradually varying in diameter, a test pattern forming region 2b where a board is of solid land and the through-holes 16 are arranged gradually varying in a space between the adjacent through-holes 16, and a second test pattern forming region 3 where through-holes 16 are arranged varying gradually in diameter, and a surface judgment region 5 where through-holes 16 of prescribed diameter are arranged at a regular interval are subjected to a soldering test under the same condition, the soldering properties of the test pattern forming regions are evaluated, whereby the effect of a through-hole pitch, the diameter of the land 15, and the diameter of the through-hole 16 on soldering properties is quantitatively detected, the soldering uniformity of a large number of through-holes under the same condition is ascertained through all the surface, and soldering data for setting optimal thermal conditions for soldering a printed wiring board can be obtained.
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