| 摘要 |
PROBLEM TO BE SOLVED: To provide a pattern structure which can increase the reliability of a conductor wire and improve degree of latitude in design and its manufacturing method. SOLUTION: This pattern structure has a substrate 11, a lower pattern 19 formed on the substrate 11, an insulating resin 12 formed on the substrate 11, a conductor thin film composed of four layers of 1st to 4th metal thin films 13, 14, 15, and 16, etc. This pattern structure has an internal conductor 17 (plating metal) surrounded except its upper part on the conductor thin film and also has an upper conductor 18 (plated metal) on the conductor thin film and internal conductor 17. |
