| 摘要 |
PROBLEM TO BE SOLVED: To electrically and mechanically connect a lead wire to a conductive layer without using a reinforcing plate by connecting the flat part arranged in the tip part of the lead wire to the conductive layer of a film base board forming the conductive layer on an insulating film by using an anisotropic conductive film. SOLUTION: In a film base board 1, a conductive layer 1b forming a circuit pattern of a metallic thin plate composed of copper or a copper alloy is arranged on a flexible insulating film 1a, and land 1c is arranged in the end part of the conductive layer 1b. A lead wire 2a of an electronic part 2 has on the tip the flat part 2b crushed by press working. An anisotropic conductive film 4 taken out according to a shape of the land 1c is placed on the land 1c, the flat part 2b of the lead wire 2a is superposed on it, and the anisotropic conductive film 4 is pressurized from both sides to be joined by heating. The flat part 2b may be formed by bending/crushing the tip part of the lead wire 2a in a U-shape. Thus, the contact area increases to increase electric current capacity and mechanical strength.
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