| 摘要 |
PROBLEM TO BE SOLVED: To enhance bonding of a bonding pad and a bonding wire by a method wherein a plurality of lower-layer interconnections are formed respectively in annular shapes so as to be laid and piled up, and the bonding face of the bonding pad is formed to be concave. SOLUTION: A first lower-layer interconnection 13, a second lower-layer interconnection 15 and a third lower-layer interconnection 17 which are annular are laid and pilled up via an insulating film 14, an insulating film 16 and an insulating film 18. As a result, parts of the respective lower-layer interconnections 13, 15, 17 which are annular protrude necessarily to the upper part from their peripheral parts as a whole. Consequently, also a bonding pad 19 which is formed on them has a shape along their shapes, and it is formed to be a smooth concave P which has an inclination wall and a bottom wall. As a result, the bonding area to the bonding pad 19 of a bonding wire 21 is expanded, and the bonding force of the bonding wire is strengthened. |
