MANUFACTURE OF SEMICONDUCTOR PACKAGE

摘要

PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor package, whereby mass productivity is high and material cost, assembling cost and testing cost can be reduced. SOLUTION: A wafer has a plurality of chips, each of which has a bump electrodes 42. A substrate has a plurality of packaging boards, which have electrode pads 52 on a plane a and electrode pads 53 connected to the electrodes pads 52 on a plane b and are respectively arranged, corresponding to the chips. The chips and the substrate are bonded with an epoxy adhesive 60, so that corresponding chips face the package boards and corresponding bump electrodes 42 are connected to the electrode pads 52. Solder bumps 54 are formed on the electrode pads 53. The bonded wafers and substrate are cut into chip units, and the cut faces are coated with epoxy resin.