| 摘要 |
PROBLEM TO BE SOLVED: To provide a ceramic circuit board which is effectively protected against cracking or chipping by a method wherein stress that is produced and left in a brazing filler metal when a metal circuit board is brazed to the metal layer of a ceramic board and other stress generated when the ceramic circuit board is fixed on a support member are prevented from being compounded together to get bigger. SOLUTION: A metal layer 2 is deposited on the surface of a ceramic board 1, a metal circuit board 3 is mounted on the metal layer 2 through the intermediary of a brazing filler metal 4 making its underside face downward for the formation of a ceramic circuit board, where a frame-shaped spacer member 3a is provided between the underside periphery of the metal circuit board 3 and the top surface of the ceramic board 1 bearing against them, an inner part of the underside of the metal circuit board 3 surrounded with the spacer member 3a is bonded to the metal layer 2 through the intermediary of the brazing filler metal 4.
|
