| 摘要 |
PROBLEM TO BE SOLVED: To obtain a printed board which is capable of coping with a reduction in a development cycle. SOLUTION: A pair of pads 1A where a large electronic part is soldered are provided, a square solder resist 3 is formed on a part of each pad 1A near to its edge opposed to that of the other pad 1A, and a small pad 2A is provided inside each solder resist 3. In a manufacturing process where the pads 1A are manufactured for a large electronic part 6, when it is informed that a large electronic part 6 is replaced with a small electronic part 7 due to a changed in the specifications of an electronic equipment, the small electronic part 7 can be soldered to the small pad 2A, whereby the soldered electronic part can be prevented from levitating or getting out of position.
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