| 摘要 |
PROBLEM TO BE SOLVED: To provide a high-density semiconductor mounting board which can be operated at high speed by a method wherein a mounting area is reduced and a wiring length is shortened and to provide a semiconductor device which is mounted on the mounting board. SOLUTION: A plurality of semiconductor devices 10a, 10b in which conductive balls are used as connecting terminals are mounted on a circuit board 1. At this time, the semiconductor devices which are adjacent are deviated up and down, and they are arranged in such a way that they are overlapped with each other so as to be adjacent. Since the adjacent semiconductor devices are overlapped, their mounting area is reduced, a wiring length between the semiconductor devices becomes short, and their high-speed operation becomes favorable. In addition, a mounting board used for a memory system in which one run-path DRAM or the like is always operated and in which another semiconductor device is in a standby state plays the role as a heat spreader in which the semiconductor device in the standby state disperses heat generated from the semiconductor device in an operating state when the adjacent semiconductor devices come into contact.
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