| 摘要 |
PROBLEM TO BE SOLVED: To provide contact pins with conductive balls and a socket for electronic parts capable of performing good contact without giving damage to the conductive balls. SOLUTION: A socket 1 for testing a BGA package 10, according to this invention, includes contact pins 20 consisting of spiral coil springs 20a and stored in spring storage holes 51 in a ball guide 50 and a positioning setting 40 provided thereon. In this way, good contact is performed without giving damage to conductive balls 11. When the contact pins 20 consisting of the spiral coil springs 20a contact the conductive balls 11, spiral contact portions are formed and a contact area is increased, resulting in good connection. Similar effect is obtained in application for upper spiral compression coil springs 20b.
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