| 摘要 |
<p>PROBLEM TO BE SOLVED: To effectively prevent the occurrence of cracks in a package and the generation of peel-offs of the package from a substrate due to increase in internal stress, when the side of the element mounting surface of the substrate is resin-sealed, even when a batch-sealing system capable of sharing a molding metal mold therewith is adopted. SOLUTION: In this method, the manufacture of a semiconductor device of a structure, wherein in a substrate 1 sectioned into a plurality of element- mounting regions S, a semiconductor element 3 is mounted each element- mounting region S and after the side of a element mounting surface (fa) of the substrate 1 is resin-sealed, in a state that at least the two regions S or more are covered with the surface (fa) in batch, the substrate 1 is split along section lines L for sectioning a plurality of the regions S, is conducted. In this case, before the side of the element mounting surface (fa) is resin-sealed, slit- shaped through-holes 2 are formed in the substrate 1 along the section lines L for sectioning the regions S.</p> |
