| 摘要 |
PROBLEM TO BE SOLVED: To obtain a power semiconductor module which prevents the exfoliation of a bonding face due to the difference in thermal expansion between a wiring member and a power semiconductor chip. SOLUTION: In this power semiconductor module, a power semiconductor chip 3 which is placed on an insulating board is provided, In addition, a electrode opposite part 6A which is formed of a flat sheet metal and which is faced with the electrode part of the power semiconductor chip 3 is provided. In addition, a rise part 6B which is bent from the electrode opposite part 6A so as to be extended is provided. Moreover, a wiring member which comprises a derivation part which is continued to the rise part 6B is provided. The electrode part of the power semiconductor chip 3 and the electrode opposite part 6A in the wiring member are connected by a conductive resin 12. |
