LEAD FRAME FOR SEMICONDUCTOR DEVICE HAVING MULTI-PLATED LAYERS

摘要

PURPOSE: A lead frame for semiconductor having a plated layer of a multilayer structure is provided to simplify the manufacture process and reduce the cost. CONSTITUTION: A lead frame has a multilayer plated structure in which the first plated layer, for example, a copper-nickel alloy plated layer(40) and the second plated layer, for example, a palladium-containing plated layer(50) are sequentially stacked on a substrate(10). The portion of nickel in the copper-nickel alloy layer(40) is 1-60 weight% and the thickness of the copper-nickel alloy layer(40) is 1-10 micrometers. The thickness of the palladium-containing plated layer is 0.05-2 micrometers.