| 摘要 |
PROBLEM TO BE SOLVED: To provide a reflow device and a method, where specific parts are prevented from rising excessively in temperature and a proper amount of heat is given to a printed board by a method wherein electronic parts are made uniform in a temperature rise rate independent of the mounting state of a printed board and the properties of the parts so as to make all the printed board uniform in temperature rise rate. SOLUTION: A nozzle part 12 is formed of a flat plate provided with openings 13 arranged at a regular interval corresponding to mounting conditions such as the part mounting density of a printed board 4 and the shape, thermal capacity, and withstand temperature of electronic parts 15, where the openings 13 are partially blocked so as to make all the printed board equal in a temperature rise rate, and then a reflow soldering operation is carried out.
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