| 摘要 |
PROBLEM TO BE SOLVED: To surely fill a sealing resin in underfilled parts of a work, a board mounted with semiconductor chips, to make a highly reliable resin seal. SOLUTION: The apparatus for sealing a semiconductor device with a resin is one in which a work 40, having a semiconductor chip 12 mounted on a board 10, is clamped with upper and lower dies 26, 28 and a sealing resin 14 is fed with pressure and filled in underfilled parts of the work 40 for sealing a junction between the semiconductor chip 14 and substrate 10. The semiconductor chip 12 is housed in one of the upper and lower dies 26, 28, and a cavity 62a is provided for closing the back face and side face of the semiconductor chip 12 through a release film 20, except for the end of a gate 70 which communicates with the underfilled parts. |
