| 摘要 |
PROBLEM TO BE SOLVED: To provide a circuit board and a manufacturing method thereof, where the adverse effects of wet etching on an environment or human bodies are lessened and a board can be improved in degree of freedom of processing by a method wherein etching by the use of gas is employed in place of wet etching. SOLUTION: An opening 502 is provided to a silicon board 501 by dry etching, and fine through-holes 506 are provided to a lid member 504 by dry etching, and the silicon board 501 and the lid member 504 are joined together through the intermediary of a metal wiring 503. By this structure, a metal wiring 50 serves as a transmission line making the air serve as a dielectric body, so that it can be lessened in dielectric loss. The through-holes 506 can be optionally changed in number and diameter, so that the lid member 504 can be controlled in apparent dielectric constant as a whole, a circuit design can be enhanced in degree of freedom, and a circuit board of high performance can be easily manufactured.
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