| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device in which heat can be dissipated with good efficiency when semiconductor elements are mounted on both the surface and the rear of a board and which has a heat dissipating structure suitable for a mounting operation on both faces of the board. SOLUTION: A plurality of semiconductor elements are provided, and a board 1 in which the plurality of semiconductor elements are mounted on the surface and the rear is provided. The semiconductor elements on one face out of the surface and the rear are arranged so as to be deviated by 1/2 or higher of the length of one side of element bodies of the semiconductor elements on the other face out of the surface and the rear along the direction of the side. Spaces in which the semiconductor elements are not mounted in a width of 1/2 or higher are ensured on a face on the opposite side of the face of the board on which the semiconductor elements are mounted. Alternatively, a plurality of semiconductor elements are provided. In addition, a board in which a plurality of semiconductor elements are mounted on the surface and the rear is provided. Moreover, a heat insulating layer which is formed on the inside of the board by keeping a prescribed distance from the surface and the rear so as to correspond to positions of the mounted semiconductor elements is provided. Furthermore, a space which is ensured on the other face out of the surface and the rear so as to correspond to the semiconductor elements mounted on one face out of the surface and the rear and which is used to dissipate heat is provided. |
