| 摘要 |
PROBLEM TO BE SOLVED: To obtain a method of manufacturing a semiconductor device which can increase inspection reliability and efficiency by removing the biased wear caused by friction on the probe needles used for inspection. SOLUTION: In this manufacturing method for simultaneously inspecting a plurality of chip parts 11 of a semiconductor wafer as semiconductor chips to be later formed by separating them with the use of probe needles 20, when the inspecting probe needles 20 are brought into contact with electrode pads 11a of the chip parts 11, a passivation film 26 is opened so that the needles do not abut against the passivation film at preset positions, where the probe needles 20a are to abut against broken chip parts 12 in the periphery of the wafer.
|
