| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a resin-molded semiconductor device in which a lead will never dislocate from a probe of a terminal in the case when a rectangular armor resin is turned inside a pair of positioning blocks at a time when the armor resin is positioned in the pair of positioning blocks arranged in the diagonal direction. SOLUTION: In this resin-molded semiconductor device, a semiconductor pellet 1 is mounted on an island 2 which comprises suspension pins 3 at least in corner parts, electrodes on the semiconductor pellet 1 are connected electrically to leads 4 arranged near the island 2, and a main part including the semiconductor pellet 1 is covered with a resin 6. End parts of the suspension pins 3 which are extended from the corner parts of the island 2 are extended by a prescribed length.</p> |
